Fingerprint Cards has launched its first fingerprint sensor designed for under-glass applications.
Called the FPC1268, the sensor could be integrated under the glass face of a smartphone, enabling appealing new design options for mobile OEMs. And indeed, FPC says that clients are already starting to work on such solutions, aiming to bring these devices to market for the second half of the year. Moreover, while the initial iteration of FPC1268 supports scanning through 300 µm cover glass, FPC is working to enable its use with glass up to 400 µm in thickness.
Commenting in a statement, FPC CEO Jörgen Lantto highlighted both the “innovative industrial designs” that the new technology allows and its economic advantages, asserting, “Thanks to its cost effective design as well as the ease of integrating FPC1268 together with the cover glass of the smartphone, FPC1268 enables a highly cost competitive solution for embedding a fingerprint sensor under the cover glass.”
FPC has also announced a collaborative effort with cover glass specialist TPK to develop a working sensor-under-glass solution, which the companies can customize for OEM clients going forward. Given FPC’s prominence as a sensor supplier to mobile OEMs, this could prove to be a very advantageous partnership for TPK as it helps to further solidify FPC’s strong position.