“The move comes amid growing excitement over 3D imaging in consumer devices, not least because of the iPhone X’s dual-camera system, which supports 3D face mapping and sophisticated AR and VR capabilities.”
LG is investing in 3D camera technology with a new licensing agreement with CEVA.
The South Korean electronics company’s new 3D camera module solution features a Rockchip RK1608 coprocessor leveraging CEVA-XM4 imaging DSPs (Digital Signal Processors) to enable capabilities like biometric facial recognition, gesture recognition, and other such capabilities. The 3D imaging technology can also be used to support VR and AR applications.
The move comes amid growing excitement over 3D imaging in consumer devices, not least because of the iPhone X’s dual-camera system, which supports 3D face mapping and sophisticated AR and VR capabilities. But even before that device was announced, Qualcomm announced a partnership with fabless semiconductor specialist Himax to develop 3D depth sensing technologies, signalling a growing interest in such technologies amid components suppliers for consumer devices.
For its part, LG appears to have broader aims for its 3D imaging module, citing “consumer electronics and robotic applications” in a statement announcing the CEVA partnership.
LG says it will demonstrate the 3D imaging module at next week’s CEVA Technology Symposium Series in China and Taiwan, which runs from October 23rd to October 27th.