NXP Leans to Strengths for Embedded World 2018

“The plans suggest that NXP is seeking to lean to its strengths now that its automotive and connected device businesses have emerged as the company’s key revenue drivers.”

NXP Semiconductors is getting ready to show off smart car and Internet of Things technologies at the upcoming Embedded World 2018 conference, the company has announced.NXP Leans to Strengths for Embedded World 2018

NXP says it will demo a new electric car development platform called GreenBox. According to a statement from the company, the solution is meant to enable automakers and suppliers “to begin early development” of next-generation electric vehicles using NXP’s S32 processing system, which is based on ARM Cortex technology. NXP will also showcase various edge computing technologies including machine learning, machine vision, smart home, smart retail, and voice recognition, all through kiosks connected to a local edge computing system that can operate outside of the cloud.

The plans suggest that NXP is seeking to lean to its strengths now that its automotive and connected device businesses have emerged as the company’s key revenue drivers. But it’s also going to place a strong focus on security solutions at Embedded World, with plans to demo new “plug & trust” offerings including “mutual device authentication in a network using a secure element”, “zero-touch connection to IoT cloud service” based on a secure element”, and a biometric authentication solution based on NXP’s Kinetis wireless MCUs.

Embedded World 2018 will run from February 27th to March 1st in Nuremberg, Germany, with NXP slated to showcase its wares from booth #4A-220.