NXP, Samsung, Bosch, and HID Global Form FiRa Consortium to Promote UWB Tech

NXP, Samsung, Bosch, and HID Global Form FiRa Consortium to Promote UWB Tech

A group of industry leaders has formed a coalition to promote and set standards for Ultra-Wideband (UWB) technology. The founding members of the FiRa Consortium are NXP, Samsung, Bosch, and the ASSA ABLOY Group that includes HID Global. The first companies to sign on with the new organization are Sony Imaging Products & Solutions Inc., LitePoint and the Telecommunications Technology Association.

The FiRa name stands for “Fine Ranging,” while the Consortium itself will adopt and then seek to improve on the IEEE standard 802.15.4/4z. The organization argues that UWB tech is more accurate than the alternatives, and is pitching it for a number of different wireless applications, including access control, peer-to-peer services, and navigation. UWB technology is designed to support the low-power transmission of high-bandwidth communications over a short range.

“As an industry consortium, we believe UWB technology can transform the way people experience connectivity, and we’re committed to the widespread adoption of interoperable UWB technologies,” said Samsung Engineering VP and FiRa Consortium Chair Charlie Zhang.

The FiRa Consortium will be headquartered in Beaverton, Oregon, where the founding members are inviting other companies to join and share their expertise.

NXP recently became the first company to achieve Mastercard’s CAST certification, while HID Global’s Crescendo smart cards achieved FIDO2 compliance and Samsung formed a joint 5G sales team with NEC.